发明名称 Compound semiconductor device and method of manufacturing the same
摘要 There are provided a compound semiconductor device having a semiconductor multilayered structure, and a method of manufacturing the same. The semiconductor multilayered structure consists of a first recess etching stopper formed on a conductive layer of a compound semiconductor, a first semiconductor layer formed on the first recess etching stopper layer, a second recess etching stopper layer formed on the first semiconductor layer, and a second semiconductor layer formed on the second recess etching stopper layer.
申请公布号 US6180968(B1) 申请公布日期 2001.01.30
申请号 US19970866268 申请日期 1997.05.30
申请人 NEC CORPORATION 发明人 KASAHARA KENSUKE;OHNO YASUO;OHKUBO SATORU
分类号 H01L21/28;H01L21/285;H01L21/306;H01L21/335;H01L21/338;H01L29/41;H01L29/778;H01L29/812;(IPC1-7):H01L31/072 主分类号 H01L21/28
代理机构 代理人
主权项
地址