| 摘要 |
PROBLEM TO BE SOLVED: To easily conduct positioning for fixing a loadable load port apparatus to the loading surface of a semiconductor manufacturing apparatus. SOLUTION: At an external wall plate 11 of a semiconductor manufacturing apparatus D, upper and lower positioning pins 16a, 16b are provided as projected means to the region, where an apparatus body A of a load port apparatus L1 is mounted, elongated pin holes 17a, 17b corresponding to the positioning pins 16a, 16b are also provided to a loading plate 2 to form the apparatus body A, and positioning is conducted by inserting the positioning pins 16a, 16b into the pin holes 17a, 17b. |
