摘要 |
<p>PROBLEM TO BE SOLVED: To correct relative position slippage due to thermal expansion or softening of frit glass and to stick together an electron source substrate and a face plate at high position accuracy, by conducting a sealing process for joining a first substrate and a second substrate through a joining member and a positioning process of the first substrate and the second substrate in vacuum. SOLUTION: In the manufacturing apparatus of a flat-type image forming device, joining members 23 are formed previously in a face plate 141 and a rear plate 145, and connected within a vacuum chamber 10 via support frames 22. An adjusting stage 30 adjusts positions in the X, Y,θdirections of the face plate 141, and a heating plate 31 heats the face plate 141. A Z-adjusting mechanism 32 makes the face plate 141, the rear plate 145, and the support frames 22 contact, and then applies pressure on them. An adjusting stage 33 adjusts the positions in the X, Y,θ-directions of the rear plate 145, and a heating plate 34 heat the rear plate 145.</p> |