| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a silicon wafer holding/transfer jig, which is free of the possibility of damaging the surface of a wafer being held and transferred and which has a normal lifetime. SOLUTION: In this manufacturing method, of three rod-like members a1 to a3 and end plate members b1 and b2, which are made from a PCTFE resin (of Shore hardness D80), the members a1 to a3 attached to a lower fixing jig N has their ends brought into contact with the corresponding plate ends of the members b1 and b2 attached to an upper fixing jig M. Then, the jig M is made to vibrate at 240 Hz for several seconds, to fuse the contact surface portion by the frictional heat produced during vibration for joint of the members through fusion. |
