| 摘要 |
PROBLEM TO BE SOLVED: To provide a module whose thickness does not increase, when a semiconductor device is mounted. SOLUTION: A semiconductor device 47 is accommodated in an accommodating part 57 of a laminated board 10a of a vessel side, bonding pads 42 of the semiconductor device 47 are made to abut against upper parts of bumps 16a exposed to the bottom surface of the accommodating part 57, and a sticking layer on the accommodating part 57 is fused by heating and pressing. After the semiconductor device is stuck on the laminated board 10a of the vessel side, a laminated board 6b of a lid side is electrically and mechanically connected with the laminated board 10a of the vessel side. Thereby a module 65 where the semiconductor device 47 is buried in a multilayer board 10 can be obtained. A shielding part 28 having a large area is arranged in the vicinity of a circuit-forming surface 49 of the semiconductor device 47 and connected with a ground potential, so that noise does not infiltrate into the semiconductor device 47. |
