发明名称 METHOD FOR WELDING COIL TO INTEGRATED CIRCUIT OR TO MINI ELECTRONIC UNIT
摘要 PURPOSE: A method for welding coil to integrated circuit or to mini electronic unit is provided to protect a circuit or an electric unit from a machine stress or from a heat stress by preparing a preliminary process which removes an insulation coating from an electric wire. CONSTITUTION: A preliminary process removes an insulation coating partly from an electric wire(10) before a real welding process in a place which terminal parts(6,8) for welding to an electronic contact pad/bums(24,26) is located in. A heating press melts or sublimates the insulation coating in high temperature. A welding process is performed in much lower temperature than the preliminary process and permits a heat/machine stress against an integrated circuit(2) and the bumps(24,26) to decrease, while welding the terminal parts(6,8) to the bumps(24,26).
申请公布号 KR20010006894(A) 申请公布日期 2001.01.26
申请号 KR20000015973 申请日期 2000.03.29
申请人 EM. MICRO ELECTRONIC-MARIN CO., LTD. 发明人 TOERIN, ELKO;KATIN, PASKAL;TIEMAN UE
分类号 H05K1/18;B23K20/10;(IPC1-7):H05K1/18 主分类号 H05K1/18
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