发明名称 |
METHOD FOR WELDING COIL TO INTEGRATED CIRCUIT OR TO MINI ELECTRONIC UNIT |
摘要 |
PURPOSE: A method for welding coil to integrated circuit or to mini electronic unit is provided to protect a circuit or an electric unit from a machine stress or from a heat stress by preparing a preliminary process which removes an insulation coating from an electric wire. CONSTITUTION: A preliminary process removes an insulation coating partly from an electric wire(10) before a real welding process in a place which terminal parts(6,8) for welding to an electronic contact pad/bums(24,26) is located in. A heating press melts or sublimates the insulation coating in high temperature. A welding process is performed in much lower temperature than the preliminary process and permits a heat/machine stress against an integrated circuit(2) and the bumps(24,26) to decrease, while welding the terminal parts(6,8) to the bumps(24,26).
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申请公布号 |
KR20010006894(A) |
申请公布日期 |
2001.01.26 |
申请号 |
KR20000015973 |
申请日期 |
2000.03.29 |
申请人 |
EM. MICRO ELECTRONIC-MARIN CO., LTD. |
发明人 |
TOERIN, ELKO;KATIN, PASKAL;TIEMAN UE |
分类号 |
H05K1/18;B23K20/10;(IPC1-7):H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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