发明名称 SOUND ABSORBING BODY
摘要 PROBLEM TO BE SOLVED: To enhance sound absorption performance and to reduce a cost and weight by constituting a sound absorbing body of a fiber molding subjected to embossing on at least one surface. SOLUTION: At least one surface of the fiber molding is subjected to profiling as embossing. The profiling refers to the formation of corrugated ruggedness on the surface of the fiber molding. The waveheight of such corrugations is not particularly limited and is preferably specified within a range of 5 to 95% in the waveheight 2a with respect to a fiber molding thickness t. The more specific examples of embossing includes hot compression molding, profiling, etc. The sound absorbing body consists of the fiber molding according to such constitution and, therefore, the sound absorption performance is good. Since the fiber molding may be molded to a free shape, its weight and cost may be reduced by subjecting its surface to embossing.
申请公布号 JP2001022359(A) 申请公布日期 2001.01.26
申请号 JP19990194694 申请日期 1999.07.08
申请人 BRIDGESTONE CORP 发明人 CHOMEI HAJIME;MURASE MASANORI;INO FUMITAKA;MIYAZAKI TOSHIHIRO
分类号 E01F8/00;E01F8/02;E04B1/99;G10K11/16;(IPC1-7):G10K11/16 主分类号 E01F8/00
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