| 摘要 |
PROBLEM TO BE SOLVED: To obtain a general transponder which can securely hold the components of a circuit at mutual positions and which can be manufactured by a simple and economical method, especially by a method almost eliminating generation of useless parts. SOLUTION: The transponder 1 is provided with an electric circuit 2, a supporting body for encapsulating the circuit 2 and a capsule 6 for completely encapsulating the circuit 2 and including hot melt adhesive. The hot melt adhesive preferably consists of polyamide and the circuit 2 is encapsulated under a moderate condition of low pressure and low temperature by the adhesive as compared with a conventional injection molding method. The transponder 1 is arranged in an injection metal mold capable of supporting the transponder 1 by leg parts 17 and a material is injected to the periphery of the transponder 1 by a normal injection molding method, so that the transponder 1 can be encapsulated into an injection molded part, e.g. a coin 20. Thereby the transponder 1 is provided with outer packaging 21 having durability. |
