| 摘要 |
PROBLEM TO BE SOLVED: To enable continuous production without detecting bonding failure troubles, even when the bonding process is applied to unconnected pads. SOLUTION: A potential difference between the top end of a bonding tool 22 and a ground GND of a wire bonder 20 in a normal pad bonding process is held beforehand as a normal voltage. If the potential difference between the top end of the bonding tool 22 and the ground GND of the wire bonder 20 disagrees with the normal voltage in the bonding process, a decision circuit 13 cannot receive a normal voltage detect signal outputted from a normal board detector circuit 11 during the bonding process, hence a cancel instruction is sent to a bonding failure detector circuit 12. According to this cancel instruction, the bonding failure detector circuit 12 omits for the pads a bonding failure detection process of wire bonding which is to be executed, whenever the bonding process ends and the tool leaves the pads. |
