| 摘要 |
PROBLEM TO BE SOLVED: To provide a microwave package having suppressed mutual interference between high-frequency devices. SOLUTION: In this microwave package, a cavity and a micro strip line 8 are provided integrally with a dielectric. A triplate line is provided integrally with a dielectric in a lower layer of the cavity. The micro strip line and the triplate line are connected by a vertical feeding via 13. The cavity periphery and the triplate line periphery are shielded from the outside by a shielding via. Consequently, since wiring can be constituted in a three-dimensional structure, high-density mounting can be achieved in the obtained microwave package while complicated wiring can be provided to prevent interference between lines and mutual interference between high-frequency devices therein. |
