| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the mounting property of parts, to thin the thickness of a whole circuit board and to lighten it by filling an insulating material between a circuit board formed of an inorganic material and a circuit board made of synthetic resin, SOLUTION: In a multilayer substrate, two resin circuit boards 15 having the circuit patterns of two layers, and plural inorganic circuit boards 16 which have the circuit patterns of two layers and in which ceramic, glass and mica are set to base materials, are mutually fixed. Insulating materials 17 are filled between the inorganic material substrates 16 or between the inorganic material substrate 16 and the resin circuit board 15 so as to form an insulating layer. Electronic components 35 such as a passive element and a semiconductor circuit element are mounted on the surface of the multilayer substrate, namely, the outer surface of the resin circuit board 15 and the multilayer substrate where the parts 35 are already mounted is cut into prescribed sizes.</p> |
