| 摘要 |
PROBLEM TO BE SOLVED: To provide high conductivity and high heat resistance by sequentially forming a silicon polymer compound layer, a nickel layer, and a gold layer on a silica surface. SOLUTION: After silica powder is treated with a silicon polymer compound having a reducing property and its surface is treated with a solution containing metal salt with a standard oxidation-reduction potential of 0.54 V or more for depositing metal colloid, electroless nickel-plating and gold-plating is applied, and consequently, conductive silica having lamination of a silicon polymer compound layer, a nickel layer, and a gold layer layered sequentially on the silica surface is provided. The conductive silica has high conductivity and high heat resistance hardly causing peeling of the plated layer in a heating process at 200 deg.C or more. If silicone rubber and the like is blended, a conductive rubber molding with high reliability can be provided. In this way, powder exhibiting high conductivity is provided. Especially, when silica is dispersed in a reducing agent-containing aqueous solution and non-electrolytic plating is carried out in the nickel plating process during the manufacture, coagulation-free conductive silica with a four-layer structure consisting of silica, a silicon polymer compound, nickel and gold is provided.
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