| 摘要 |
PROBLEM TO BE SOLVED: To join electronic components to a substrate reliably with improved productivity by easily adjusting and observing parallelism between a press tool and a stage in a packaging process, such as the compression or the leveling process of electronic components. SOLUTION: When electronic components 5 are to be mounted to a circuit substrate 6, a press tool 1 is pressed against a substrate stage 2 for generating Newton interference fringes by light from a light source 3, and the interference fringes are detected by an image-detecting device 4. Then, by observing, adjusting, and confirming the parallelism between the press tool and the substrate stage in advance, the parallelism can be controlled surely and the electronic components can be mounted to the substrate. |
