| 摘要 |
PROBLEM TO BE SOLVED: To release a load during the bonding to a substrate mounting semiconductor elements via a second surface by providing a bonding pad within the area of a first surface just opposing to the second surface. SOLUTION: A semiconductor element 50 is provided with a pad 51 for the wire bonding at a first surface 50b of a semiconductor substrate 50a. The bonding pad 51 is formed in the same number as an LED 53 formed to the semiconductor element 50 to connect a pair of the bonding pad 51 and LED 53 with the individual electrodes 55. Moreover, the semiconductor element 50 respectively forms the first side surface 50c and second side surface 50d, crossing in both sides in the first direction of the first surface 50b, as the slopes that is entering the semiconductor element side as it goes to the second surface 50 opposing to the first surface 50b. |
