| 摘要 |
PROBLEM TO BE SOLVED: To prevent short circuit between a heat-radiation plate and an inner lead, and effectively transfer heat from the inner lead, related to a resin sealed semiconductor device incorporated a heat radiation plate formed by injecting a resin with a die. SOLUTION: A lead frame 3 where a semiconductor element 2 is mounted is provided on one surface of a heat radiation plate 10. The heat radiation plate 10, semiconductor element 2, and lead frame 3 are sealed with a resin 5. Related to the heat radiation plate 10, an outer edge (heat dispersion part) 10b is bent in the opposite direction on the side where the lead frame 3 is arranged. Thus, the resin flows downward to the heat radiation plate 10 when the resin is injected into a die, so the tilt and rise of the heat radiation plate 10 are prevented at resin molding. Since the interval between the inner lead 3b and the heat radiation plate 10 is larger, the contact between them is easily prevented. |
