| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, together with its manufacturing method, which shows sufficient noise reduction effect. SOLUTION: A specified wiring pattern is formed on one main surface of a substrate 2. In short, a plurality of land parts 3 are formed. On the substrate 2, a resist layer 4 comprising solder resist is formed between the land parts 3. An adhesive layer 8 is formed on the resist layer 4 of a chip mounting part, and a bare IC6 which is a semiconductor element is mounted on the adhesive layer 8. With an electrode 7 formed on the upper surface of the bore IC6, the electrode 7 and the land part 3 formed on the substrate 2 are electrically connected together with a wire 9 of a connecting member. A ferrite paste layer 10 comprising at least CuO is formed on one main surface of the substrate 2. On the other main surface of the substrate 2, a connection land 5 and the resist layer 4 are formed. |
