| 摘要 |
PROBLEM TO BE SOLVED: To ensure flatness of a flexible board or a circuit board by locally heating the part of a metal frame applied with adhesive and bonding a flexible board to the metal frame thereby retarding thermal deformation of the metal frame and the flexible board. SOLUTION: Using a heat block 4 provided with a part 4A for locally heating a metal frame 1, a flexible board 2 comprising a polyimide insulating film formed with a plurality of circuit boards 2A is bonded to the metal frame 1 through thermoplastic or thermosetting adhesive 3. The heating part 4A is formed to have a level difference from the surface of the heat block 4 and heats the part of the metal frame 1 applied with adhesive 3 from the rear side over contact length and width smaller than those of the part applied with adhesive 3. According to the method, thermal deformation of the metal frame 1 and the flexible board 2 can be retarded while ensuring flatness of the flexible board 2. |
