PRINTED BOARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To form parts covering interlayer connection for respective layers by burying a part of or all wirings and interlayer connection terminals in an adhesive base material. SOLUTION: Wirings 2 or interlayer connection terminals 3 are buried in an adhesive base material 1 and interlayer connection is obtained in mutually corresponding parts. The corresponding interlayer connection terminals 3 corresponding to each other and the corresponding interlayer connection terminal 3 and wiring 2 cover electric connection. The wirings 2 are bonded to the adhesive base material 1 and they are set to be the wirings of a printed board. Since interlayer connection is executed between the desired wiring 2 and interlayer connection terminal 3 with such constitution, hole work is not required and parts covering the interlayer connection of respective layers can be formed at once. The interlayer connection of a hole diameter different from the small diameter of the interlayer connection can easily be formed. Since hole work is not required, the problem of machine precision at the time of working the hole is dissolved and the via hole of the hole diameter different from the small diameter of the via hole can easily be formed on the printed board.