| 摘要 |
PROBLEM TO BE SOLVED: To enable measurement and evaluation by pre-aligning the relative position of a plurality of probes for evaluation of an element to the contact point of the probe and then maintaining this condition for the contact of probe with the wafer surface. SOLUTION: Under the condition that a wafer 6 is allocated on a stage 13 and is then moved downward, a pre-alignment substrate 14 is loaded to a holder 17 and it is then allocated at a predetermined position with a pre- alignment substrate moving mechanism 15. When the pre-alignment substrate 14 is moved a little from such condition with a probe moving mechanism 11, the initial adjustment is performed to locate the end position of the probe 5 at the outside of the origin dot. As this initial adjustment, the position of the probe 5 corresponding to the selected pre-alignment substrate 14 is designated with a computer 100. As a result, the probe 5 can be brought into contact with a wafer 6 in a certain approximate error range. Accordingly, full automatic evaluation becomes possible.
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