| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip mount type semiconductor device and the manufacture thereof, whereby in a resin injection process, the making molding voidless and shortening of the manufacturing process can be realized. SOLUTION: This manufacturing method is such that bumps 2 on a semiconductor chip 1 and holes 7 of a sheet-like underfill resin sheet 6, and pads 5 on a multilayer wiring board 3 are aligned with each other, the bumps 2 are reflowed by heating at a temperature e.g. about 200 deg.C or higher, at which the viscosity of the resin constituting the resin sheet 6 begins to lower, thereby flip-chip bonding the chip 1 and the wiring board 3. When the underfill resin sheet 6 is made of a resin having a viscosity curing start temperature of 200 deg.C or higher and a curing start temperature of 220 deg.C or higher where the curing reaction ends by about 1-2 min, the temperature can be raised to 240 deg.C to lower the viscosity of the resin of the sheet 6, after the flip-chip bonding to have the resin cured.
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