| 摘要 |
PROBLEM TO BE SOLVED: To automatically transfer a plurality of devices to a plurality of circuits with high efficiency. SOLUTION: In this high-speed die transfer apparatus, a flexible substrate 20 holding a plurality of flexible circuits is fed from a substrate storage reel 24 to a main drum 22. Dies are fed from a die loading mechanism 44 and are collectively fixed on the periphery of a die transfer drum 34 by a vacuum chucking mechanism. The substrate passes through a fixed-die transfer region 48, where the positions and pitches of the reference positions 46 on the drum 34 are so controlled as to match with positions and pitches of the reference positions 50 relevant to the dies which are to be sequentially transferred. The substrate is then collected by a reel 26. When an antenna is included in the device, the antenna is similarly added to the circuit on the substrate from an antenna-mounting drum 32.
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