WIRE BONDING CONNECTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To reduce the cost of a mounting substrate by providing a terminal to an insulation substrate and then bonding a wire to the wire bonding surface formed of platinum of such terminal. SOLUTION: A 5-inch silicon wafer is used as an insulation substrate 1, a titanium film 2 is deposited thereon with a vacuum deposition method and a platinum film 3 is then deposite thereon. Next, a photo-resist is formed to the whole part of the platinum surface 3 and the predetermined pattern is then formed with the photolithography. The solder 4 is formed by the lift-off method to an electronic part mounting area of an electrode pattern obtained as explained above and then electronic parts are mounted. A gold wire 8 is connected with ultrasonic connection method to the wire bonding terminal 5 which becomes the wire bonding connections of the electrode pattern.