| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic component wiring materials and its manufacturing method capable of preventing entangled deformation of wiring materials with each other, facilitating wiring at the time of mounting and processing, allowing to conduct all electric tests of products for their electric continuity, insulating resistance, breakdown voltage, etc. SOLUTION: A plurality of conductors 2 laid parallel are pinched from two sides by heat-resistant insulating substance films 4 having adhesive layers 3 on the inside followed by hot pressing to be affixed together, and each film 4 is provided with slits 5 positioned between the conductors 2 to serve for tearing off, and a sticky tape layer 6 for fixing wirings is formed on one outer surface of the film 4. |
