发明名称 LEAD FRAME, MANUFACTURE THEREOF AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent plating silver from leaking along the side surfaces of inner leads when silver plating is applied in the manufacturing process of a lead frame from leaking out of a mold area by a method wherein plating silver leaking preventive dam bars are formed between the inner leads and the mold area. SOLUTION: In a lead frame whose inner lead tips are plated 7 with silver, in addition to dam bars 5 which prevent sealing resin from leaking out at the time of resin sealing, additional dam bars 9 made of metallic material are formed in the manufacturing process of the lead frame and cut off after silver plating. Further, dam bars made of UV-curing resin are formed on the middle parts of the inner leads 4. With this constitution, a desilvering process after resin sealing can be eliminated and, further, solder plating swellings of outer leads and short-circuiting between outer leads which are caused by the leaking silver can be avoided.
申请公布号 JP2001024131(A) 申请公布日期 2001.01.26
申请号 JP20000230646 申请日期 2000.07.31
申请人 SEIKO EPSON CORP 发明人 SUZUKI KAZUHIKO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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