| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting efficiency by providing an isolation layer, which isolates respective layers, has a thickness higher than a high-frequency movable part and opens the whole area where the high-frequency movable part is formed between an inner layer substrate and a layer on it. SOLUTION: The isolation layer 113 provided with an open area 113a is formed on a substrate 101. A copper film is formed on an isolation layer 19 consisting of dielectric, and this copper film is pattern-worked to form a combined layer 108 provided with a combination slot 108a on the layer 109. In addition, a conductive material film such as sold is formed on an isolation layer 111 consisting of dielectric and this film is pattern-worked to form a distribution synthetic layer 110 on the layer 111. In addition, a ground layer 112 is formed on the backside of the layer 111. The backside of the layer 109 and the forming surface of the layer 110 of the layer 111 are abutted and laminated to each other to make integral construction. The surface of the layer 108 of the integral construction and the backside of the substrate 101 are abutted through an adhesive film and heat-adhered in a state of applying a prescribed pressure. |
