发明名称 |
MANUFACTURE OF PROBE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a probe device that enables automation and reduction in manufacturing cost. SOLUTION: A line discharge polishing operation 10 uses the principle of microdischarge machining. A line discharge device machines fine electrodes in a probe. An electrochemical discharge machining operation 20 uses nonconductive material machining techniques and forms a current path in the portion of contact between a printed wiring board in an electrolytic solution and the probe machined and polished. A line discharge polishing operation 30 is performed to enhance the dimensional accuracy of the probe. A joining operation 40 solders the probe to the printed wiring board, and a cutting operation 50 cuts the probe attached thereto. These operations are repeated and a flattening operation 70 is performed to complete a probe device.
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申请公布号 |
JP2001021580(A) |
申请公布日期 |
2001.01.26 |
申请号 |
JP19990175510 |
申请日期 |
1999.06.22 |
申请人 |
IND TECHNOL RES INST |
发明人 |
YO KEITO;CHO UNKI;RA SHITETSU |
分类号 |
G01R1/073;H01L21/66;(IPC1-7):G01R1/073 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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