发明名称 TEMPERATURE REGULATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To make a thermal resistance between a thermoelectric module and a heat exchanger extremely small and to enhance the performance of the thermoelectric module by installing the heat exchanger at least on a thermoelectric plate, on one side, in the thermoelectric module in such a way that the thermoelectric plate comes directly into contact with a fluid housed at the inside of the heat exchanger. SOLUTION: A temperature regulating apparatus 10 comprises a mounting plate 10, a water-cooled plate 20 and many thermoelectric modules 30 which are interposed and mounted between them. When the respective thermoelectric modules 30 are electrified, a substrate W which is placed on the mounting plate 10s is heated/cooled, the distribution of the temperature of the mounting plate 10 composed of a platelike heat pipe becomes uniform, and the substrate W is heated/cooled by keeping the uniform distribution of the temperature. At this time, a thermoelectric plate 33 on the upper side of the thermoelectric modules 30 come directly into contact with a working medium 10L housed at the inside of the mounting plate 10, and a thermal resistance between the thermoelectric modules 30 and the mounting plate 10 can be made extremely small.
申请公布号 JP2001024240(A) 申请公布日期 2001.01.26
申请号 JP19990193115 申请日期 1999.07.07
申请人 KOMATSU LTD 发明人 TANIMURA TOSHINOBU;IMAIZUMI HISAAKI
分类号 H01L35/30;F28D15/02;F28F27/00;H01L35/08;H01L35/32;(IPC1-7):H01L35/30 主分类号 H01L35/30
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