DEFORMATION ABSORBING LEAD FRAME FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE: A deformation absorbing lead frame for semiconductor device is provided to absorb thermomechanical stress applied during molding capsule sealing process, acceleration test including temperature and moisture change, and operation of device by disposing a support member in the circumferential fringe of a chip such that it can partially operate to absorb thermally induced deformation. CONSTITUTION: Each support member(402) is fixed to the outside of the circumferential fringe of a pad(401) and to the inside of a lead frame. The support member(402) partially comprises a deformation absorbing structure(405) conforming to bend or elongation exceeding the simple elongation based on the inherent properties of material. Two support members(402) intersect at a point close to the center of a chip mount pad(401). Consequently, the deformation absorbing structure(405) is confined in the package of a completed semiconductor device and prevented from being discarded together with a rail(404) during trimming process. The deformation absorbing structure(405) is designed with such a geometry as the supporting member(402) elongates by 50-500% that of the lead frame material.