| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to remove the flaws, dirt, residual films, etc., produced in a wafer deposition stage for transparent substrates constituting liquid crystal display devices by automatic work. SOLUTION: The surfaces having TFT patterns of the wafers 10 are provided with resist films 12 and protective tapes 14 are stuck thereto. The wafers 10 are fed into a CMP device and the rear surfaces of the wafer 10 are automatically subjected to polishing, washing and drying. The wafers 10 are then taken out of the CMP device and the resist film 12 and the protective tapes 14 are removed. In the CMP device, the wafers 10 are held at a polishing head 40 and are brought into contact with a wafer pad 42 disposed atop a turn table 44. While the turn table 44 is rotatably driven and a polishing liquid is supplied, the rear surfaces of the wafers 10 are polished and the flaws, dirt, residual films, etc., produced in the wafer deposition stage are removed. The rear surfaces of the wafers 10 are then washed and dried and are transferred to the ensuing stage. |
