| 摘要 |
PROBLEM TO BE SOLVED: To provide a case for a semiconductor wherein a heat sink part where a semiconductor element is mounted and a circular base part which supports the heat sink part are integrally molded while a cap can be directly welded to the circular base part, with thermal expansion factor and heat transfer coefficient being stable for long-term reliability of a semiconductor element. SOLUTION: A heat sink 104 on which a semiconductor element 102 is mounted, a circular base 105 which supports the heat sink 104, and a cap 106 which covers the heat sink 104 and the semiconductor element 102 and jointed to the circular base 105 to form a closed space, are provided. Here, the heat sink 104 and the circular base 105 comprise an alloy wherein an integral mold of a mixed powder where tungsten powder and other metal powder are agitated and mixed is baked with a heavy alloy mechanism theory. |
