| 摘要 |
PROBLEM TO BE SOLVED: To realize a multi-chip BGA package having excellent heat dissipation in which the need of an intricate circuit pattern is eliminated by connecting the electrode pads of a plurality of semiconductor elements with the common wiring of a wiring pattern. SOLUTION: In the multi-chip BGA package having TBGA structure, semiconductor elements 3a, 3b are mounted in one cavity of a heat dissipating plate. Electrode pads are connected, with bonding wires 5a, 5b, to the circuit conductor 9 of a three layer TAB tape material where adhesive is applied to the opposite sides of a polyimide tape. One bonding wires 5A, 5B out of the bonding wires 5a, 5b from the semiconductor elements 3a, 3b are connected to the vicinity at the opposite ends of one circuit conductor 9A. According to the arrangement, a simple pattern of circuit conductor 9 can be employed on the TAB tape material even when two semiconductor elements 3a, 3b are mounted. Furthermore, heat is dissipated sufficiently from the semiconductor elements 3a, 3b because they are attached to a heat dissipating plate 4 through heat dissipating paste.
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