| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device, constituted into such a structure that an embedded wiring consisting of a healthy conductor having not a defect can be formed in a microscopic recessed part and the manufacturing method of the device. SOLUTION: In a semiconductor device of a structure, where a wiring is embeddedly formed in a microscopic recessed part 5 provided in the surface of a semiconductor substrate W, wiring is formed in such a way that the wiring is constituted of a plated metal copper film grown in one direction from the bottom of the recessed part 5 toward the end part of an aperture provided in the recessed part 5. Hereby, while the plated metal copper film constituting the wiring grows in the one direction from the bottom of the recessed part 5 toward the aperture provided in the microscopic recessed part 5 and as the growth of the plated metal copper film 7 from the sidewall part of the recessed part 5 is stopped, an embedded wiring consisting of a healthy conductor having no internal defects, such as voids or seams can be formed.
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