| 摘要 |
PROBLEM TO BE SOLVED: To decrease the number of components, reduce the number of assembling steps, realize a mass production, lower a production unit price and prevent a thermal efficiency from being lowered. SOLUTION: A manifold M for a floor heating device comprises a heat source 10, a plurality of branched and connected heat panels 20 for circulating a heating medium therebetween and at least a supply passge 2a for the heating medium and two or more of branch supply passages 3a to 3d. A manifold main body 1 is formed of a synthetic resin material integrally with the manifold M. The supply passage 2a is connected to each of the branch supply passages 3a to 3d by a supply groove 7 formed in one side of the manifold main body 1. The supply groove 7 is sealed by a sealing cover.
|
