Production of tougher SIM or mini-SIM cards used in, e.g., mobile telephones employs substrate forming body of card, and which is virtually covered by a large-area, thin integrated circuit

摘要

A large area, thin integrated circuit (2) is placed on a support (8), virtually covering all of it. The body of the card is formed by the support (8). The support (8) is glass, polymethyl methacrylate, polycarbonate, acrylonitrile-butadiene-styrene, polystyrene, polyethylene terephthalate, polyethylene naphthalate, polyvinyl chloride, polyethylene, polyamide, polyimide, polyether imide or polypropylene. An Independent claim is included for the corresponding smart card.