| 摘要 |
PURPOSE: To make the releasability between a substrate and a die, after resin sealing, superior enough to little need die cleaning works. CONSTITUTION: The semiconductor device manufacturing method comprises steps of laying release sheets 150a, 150b on parting faces 102b, 118b of first and second dies 102, 104, including their respective cavity forming faces 102a, 116a, with a die unit 100 opened, setting a substrate 152 on the release sheet 150b with a plurality of semiconductor element forming surfaces facing the second die 102 where electrodes are provided, feeding a seal resin 154 onto the substrate 152, closing and pressing the die unit 100 being heated to form a resin layer sealing electrodes on the substrate 152, ejecting the resin sealed substrate 152 with the die unit 100 opened, and dividing the substrate 152 into semiconductor device units after peeling the release sheets 150a, 150b. |
