| 摘要 |
Power electronic component (28) comprises a first composite structure (19) for thermal transfer and electric insulation, comprising two conducting or semiconducting layers (18) onto which is mounted at least one power semiconducting circuit (20) with contacts (23) connected to an array of conducting elements insulated from each other, this array being integrated into a second composite structure (119) for thermal transfer and electric insulation made of at least one semiconductor layer (110). One of the first and second composite structures comprises internal passages (12,112) for heat exchanging fluid. |
