发明名称 PC CARD AND METHOD FOR MANUFACTURING THE SAME
摘要 A PC card having a light weight and manufactured at low cost comprises a circuit board on which electronic components are mounted, an insulating layer injection-molded to cover the circuit board and made of thermoplastic resin, and a shield layer injection-molded on the insulating layer and made of thermoplastic resin. A PC card of a second mode comprises a circuit board on which electronic components are mounted, a metallic panel so mounted to cover the circuit board with a spacing, and a sealing resin of a thermoplastic resin so injection-molded as to integrate the panel and the circuit board at their side edges. A PC card of a third mode is a modification of the second mode in which the metallic panel is a plate panel mounted on spacing pieces mounted on the circuit board by a mounter simultaneously with the mounting of the electronic components. A method of manufacturing the same is also disclosed.
申请公布号 WO0105602(A1) 申请公布日期 2001.01.25
申请号 WO2000JP04879 申请日期 2000.07.19
申请人 IBIDEN CO., LTD.;NAGAYA, KUNIO 发明人 NAGAYA, KUNIO
分类号 H05K3/28;H05K5/02;(IPC1-7):B42D15/10;G06K19/077 主分类号 H05K3/28
代理机构 代理人
主权项
地址