发明名称 |
PC CARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A PC card having a light weight and manufactured at low cost comprises a circuit board on which electronic components are mounted, an insulating layer injection-molded to cover the circuit board and made of thermoplastic resin, and a shield layer injection-molded on the insulating layer and made of thermoplastic resin. A PC card of a second mode comprises a circuit board on which electronic components are mounted, a metallic panel so mounted to cover the circuit board with a spacing, and a sealing resin of a thermoplastic resin so injection-molded as to integrate the panel and the circuit board at their side edges. A PC card of a third mode is a modification of the second mode in which the metallic panel is a plate panel mounted on spacing pieces mounted on the circuit board by a mounter simultaneously with the mounting of the electronic components. A method of manufacturing the same is also disclosed.
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申请公布号 |
WO0105602(A1) |
申请公布日期 |
2001.01.25 |
申请号 |
WO2000JP04879 |
申请日期 |
2000.07.19 |
申请人 |
IBIDEN CO., LTD.;NAGAYA, KUNIO |
发明人 |
NAGAYA, KUNIO |
分类号 |
H05K3/28;H05K5/02;(IPC1-7):B42D15/10;G06K19/077 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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