| 摘要 |
<p>An epoxy resin composition for semiconductor sealing which comprises an epoxy resin, a hardener, a hardening accelerator, and a flame retardant and is excellent in flame retardancy and moldability, characterized in that the flame retardant comprises a specific boric acid compound represented by formula (1): xM(II)O.yB2O3.zH2O (wherein 0.2≤x/y≤6.0; 0.2≤z/y≤6.0; and M(II) represents a divalent metal); and a semiconductor device with excellent reliability made using the composition.</p> |
