发明名称 ENHANCED <i>n</i> TYPE SILICON MATERIAL FOR EPITAXIAL WAFER SUBSTRATE AND METHOD OF MAKING SAME
摘要 An enhanced &lt;i&gt;n&lt;/i&gt;&lt;+&gt; silicon material for epitaxial substrates and a method for producing it are described. The enhanced material leads to improved gettering characteristics of &lt;i&gt;n/n&lt;/i&gt;&lt;+&gt; epitaxial wafers based on these substrates. The method for preparing such &lt;i&gt;n&lt;/i&gt;&lt;+&gt; silicon material includes applying a co-doping of carbon to the usual &lt;i&gt;n&lt;/i&gt; dopant in the silicon melt, before growing respective CZ crystals. This improves yield of enhanced &lt;i&gt;n&lt;/i&gt;&lt;+&gt; silicon material in crystal growing and ultimately leads to device yield stabilization of improvement when such &lt;i&gt;n/n&lt;/i&gt;&lt;+&gt; epitaxial wafers are applied in device manufacturing.
申请公布号 WO0106545(A2) 申请公布日期 2001.01.25
申请号 WO2000US40360 申请日期 2000.07.12
申请人 MITSUBISHI SILICON AMERICA 发明人 KIRSCHT, FRITZ, G.;WILDES, PETER, D.;TODT, VOLKER, R.;FUKUTO, NOBUO;SNEGIREV, BORIS, A.;KIM, SEUNG-BAE
分类号 C30B29/06;C30B15/00;C30B15/04;H01L21/205;H01L21/322;(IPC1-7):H01L/ 主分类号 C30B29/06
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