| 摘要 |
PROBLEM TO BE SOLVED: To enable the formation of a fine via-hole having an aspect ratio larger than a specific level by forming a film composed of two or more layers on a substrate using a resin composition containing inorganic powder, irradiating the film with radiation, developing the exposed film and baking the formed product. SOLUTION: The objective formed inorganic material has a via-hole having an aspect ratio of >=1. It can be produced by adding a polyfunctional (meth)acrylate, a photo-polymerization initiator, a solvent and an additive to inorganic powder and a binder resin to obtain a resin composition containing inorganic powder, applying the resin composition containing inorganic powder to a substrate, heating e.g. at about 60-130 deg.C to obtain a film A having a thickness of 10-50 μm, forming a film B on the film A by a similar method, exposing the films with radiation in a desired pattern to effect the crosslinking and the insolubilization of the exposed part, dissolving and removing the non-exposed part with a developing liquid to obtain a formed material and baking the product to form a formed inorganic material. Preferably, the sensitivity of the film A is made to be lower than that of the film B e.g. by decreasing the amount of the photopolymerization initiator and the solubility of the film A to the developing liquid is made to be higher than that of the film B e.g. by the addition of a dissolution accelerator. |
