| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin molding having a high conductivity and improved mechanical strengths in good moldability, which molding is prepared from a polyolefin resin, an interfacial adhesion modifier, a low-melting metal, and a metallic powder. SOLUTION: A resin component (20-80 vol.%) comprising a polyolefin resin and 10-80 vol.% interfacial adhesion modifier and a metallic component comprising a low-melting metal having a melting point of 300 deg.C or lower and 10-30 vol.% metallic powder having a mean particle diameter of 1-50μm are kneaded at a temperature at which the low-melting metal is in a semi-molten state. The interfacial adhesion modifier which can be used is exemplified by one prepared by modifying part of a homopolyolefin with a 3-10C organic unsaturated carboxylic acid, for example, acrylic acid, maleic acid, methacrylic acid, fumaric acid, or itaconic acid. The low-melting metal which can be used is a solder alloy selected from Pb/Sn, Pb/Sn/Bi, Sn/Cu, Sn/Zn, and like systems. The metallic powder functions as a dispersion aid for the low-melting metal and is exemplified by a powder of Cu, Ni, Al, Cr, or an alloy thereof.
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