发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To attain improvement of through put per floor area, by providing a plurality of base board hold members pressing relating to a polishing table and dressing a polishing work surface by pressing its prescribed position. SOLUTION: A polishing part performs polishing action so as to generate a phase different by each about 1/3 in three top rings 16. In a polishing process, a polishing work surface 10 of a polishing table 12 is applied with dressing in a steady manner by a dresser 28. A regenerative effect of this polishing work surface 10 is completely maintained in a first polishing position P1 and reduced in a second/third polishing position P2, P3 by polishing work in the upstream thereof. Accordingly, in the case of polishing simultaneously a plurality of polishing workpieces W, by properly using the polishing position corresponding to a residual amount of a dressing effect of the polishing work surface 10 in accordance with a condition, more effective polishing can be performed.
申请公布号 JP2001018161(A) 申请公布日期 2001.01.23
申请号 JP19990193299 申请日期 1999.07.07
申请人 EBARA CORP 发明人 HIYAMA HIROKUNI;WADA TAKETAKA;HIROKAWA KAZUTO;MATSUO NAONORI;TOGAWA TETSUJI
分类号 B24B37/005;B24B37/34;B24B53/007;B24B53/017;B24D7/14;B24D13/14;H01L21/304 主分类号 B24B37/005
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