发明名称 |
Conductive diffusion barrier layer, semiconductor device having the same, and manufacturing thereof |
摘要 |
A conductive diffusion barrier layer, a semiconductor device having the same, and a method for manufacturing the semiconductor device is provided. The diffusion barrier layer contains Al, N, and a metal element selected from the group consisting of Ta, Mo, Nb, and W. The content ratio of each element is between 1 and 60 mole percent. The diffusion barrier layer further contains O having a content ratio between 1 and 50 mole percent. A capacitor using the diffusion barrier layer described above exhibits a higher capacitance because the plug formed under a storage node is prevented from being oxidized and a dielectric layer having a high dielectric constant is formed.
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申请公布号 |
US6177284(B1) |
申请公布日期 |
2001.01.23 |
申请号 |
US19980156723 |
申请日期 |
1998.09.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HORII HIDEKI;HWANG CHEOL-SEONG |
分类号 |
H01L27/04;H01L21/02;H01L21/285;H01L21/822;H01L27/108;(IPC1-7):H01L21/00 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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