发明名称 Conductive diffusion barrier layer, semiconductor device having the same, and manufacturing thereof
摘要 A conductive diffusion barrier layer, a semiconductor device having the same, and a method for manufacturing the semiconductor device is provided. The diffusion barrier layer contains Al, N, and a metal element selected from the group consisting of Ta, Mo, Nb, and W. The content ratio of each element is between 1 and 60 mole percent. The diffusion barrier layer further contains O having a content ratio between 1 and 50 mole percent. A capacitor using the diffusion barrier layer described above exhibits a higher capacitance because the plug formed under a storage node is prevented from being oxidized and a dielectric layer having a high dielectric constant is formed.
申请公布号 US6177284(B1) 申请公布日期 2001.01.23
申请号 US19980156723 申请日期 1998.09.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HORII HIDEKI;HWANG CHEOL-SEONG
分类号 H01L27/04;H01L21/02;H01L21/285;H01L21/822;H01L27/108;(IPC1-7):H01L21/00 主分类号 H01L27/04
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