发明名称 |
Reactive ion etch chamber wafer masking system |
摘要 |
Disclosed are shielding platters for semiconductor wafers, and more particularly a reactive ion etch (RIE) chamber wafer masking system, wherein a mechanical mask facilitates the implementation of multiple etches on a single semiconductor wafer.
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申请公布号 |
US6176967(B1) |
申请公布日期 |
2001.01.23 |
申请号 |
US19980154271 |
申请日期 |
1998.09.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
OBSZARNY CHRISTOPHER E. |
分类号 |
C23F4/00;H01J37/32;(IPC1-7):C23F1/02 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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