| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide precursor composition which can give a composite material resistant to curling and capable of good patterning, which composition develops a specified average coefficient of linear expansion and a relative permittivity when cured. SOLUTION: This composition develops an average coefficient of linear expansion of 5×10-6 to 25×10-6(/ deg.C) in the temperature region of 30 to 100 deg.C and a relative permittivity of at most 3.0. It is desirable that the composition contains a polymer represented by the formula and a photopolymerization initiator and/or a photosensitizer. In the formula, 65-100 mol% of R1s are pyromellitic acid residues; 0-35 mol% of R1s are 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane residues; 70-100 mol% of R2s are 2,2'-bis(trifluoromethyl)-4,4'- benzidine residues; 0-20 mol% of R2s are phenylenediamine residues; 0-10 mol% of R2s are ether-bond-containing aromatic diamine residues; R3 is OH or the like; X1 is OH or the like; Z2 is H or the like; n is 3-10,000; and m is 1 or 2. |
