| 摘要 |
A tin-based, two-component alloy electroplating composition comprising 20 to 500 g/l of a tin salt, 1 to 100 g/l of a metal salt selected from the group consisting of a zinc, cobalt, bismuth and copper salt, 20 to 200 g/l of methanesulfonic acid, 10 to 300 g/1 of a conductive compound, and 0.5 to 50 g/l of a complexing agent provides a plating layer having excellent corrosion resistance and solderability to electronic devices such as lead frames, connectors and printed circuit boards.
|
