| 摘要 |
Method of producing a printed circuit starting from a dielectric film covered by one or more superficial metallic conducting layer(s), comprising a step of demarcation of different conducting paths by mechanical machining of incisions in the conducting layer. The machining is carried out by means of a sharp-edged cutting tool allowing incisions to be cut separating said conducting paths, without removal of conducting material or depthwise indentation. For example, a stamping die or a cutting table controlling a blade can be used to cut the incisions. The method is suitable for multi-layered circuits, and is particularly adapted to flexible printed circuits, to connectors, etc. and to inductance coils used, for example, in chip cards.
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