发明名称 Two step barrier process
摘要 A process for forming a tungsten plug structure, in a narrow diameter contact hole, has been developed. The process features the use of a composite layer, comprised on an underlying titanium layer, and an overlying, first titanium nitride barrier layer, on the walls, and at the bottom, of the narrow diameter contact hole. After an RTA procedure, used to create a titanium silicide layer, at the bottom of the narrow diameter contact hole, a second titanium nitride layer is deposited, to fill possible defects in the underlying first titanium nitride, that may have been created during the RTA procedure. The tungsten plug structure is then formed, embedded by dual titanium nitride barrier layers.
申请公布号 US6177338(B1) 申请公布日期 2001.01.23
申请号 US19990246894 申请日期 1999.02.08
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 LIAW JHON-JHY;YANG CHING-YAU
分类号 H01L21/311;H01L21/316;H01L21/768;(IPC1-7):H01L21/476 主分类号 H01L21/311
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