IMPROVED CMP POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To heighten the flexibility of a polishing pad to improve the uniformity of a substrate and a die. SOLUTION: This polishing pad 44 used for a chemical-mechanical polishing system is mounted on a rotary platen 41 and comprises a polishing face and a flexible face providing the pad 44 with a desirable degree of rigidity and flexibility when coming in contact with a substrate. The flexible face can be composed of one or more passages extending through the pad 44 for ventilation to the atmosphere. In one form, protuberant areas 50 and recessed areas 62 are formed by a flexible area. The protuberant areas 60 form a mounting face 64 to the platen 41, and the recessed areas 62 are formed taking consideration of the flexibility of the pad 44.