发明名称 |
Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip |
摘要 |
A semiconductor bare chip includes a plurality of stud bumps provided on the surface of the semiconductor bare chip body, each of the stud bumps including a seat and a head protruding from the seat. A height of the head is less than a thickness of electrodes on said board.
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申请公布号 |
US6177730(B1) |
申请公布日期 |
2001.01.23 |
申请号 |
US19980021407 |
申请日期 |
1998.02.10 |
申请人 |
FUJITSU LIMITED |
发明人 |
KIRA HIDEHIKO;FUKUI KIYOSHI;TSUNOI KAZUHISA;BABA SHUNJI |
分类号 |
H01L21/60;H01L21/56;H01L23/485;(IPC1-7):H01L2/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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